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Logitech精密(mi)材(cai)料表(biao)面(mian)處(chu)理(li)
晶(jing)圓(yuan)拋(pao)光(guang)
晶圓(yuan)背減薄
碲鋅(xin)鉻(ge)材(cai)料磨(mo)拋(pao)機
三(san)五族材(cai)料磨(mo)拋(pao)機
精(jing)密(mi)研磨拋(pao)光(guang)系(xi)統
化學(xue)機械(xie)研磨拋(pao)光(guang)
智(zhi)能(neng)研磨拋(pao)光(guang)機
化學(xue)拋(pao)光(guang)設備
精密(mi)切割(ge)設(she)備
薄(bo)片制備(bei)系(xi)統
自動(dong)粘片(pian)機
粘(zhan)片(pian)、測量(liang)檢(jian)測(ce)設(she)備
備品(pin)備(bei)件(jian)和(he)耗材(cai)
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Logitech PLJ Precision Lapping Jigs are used to hold multiple “wafer geometry” or slide mounted specimens, while they are being processed on a Logitech precision lapping machine. -
The CB30 Bonding Unit and CH30 Hotplate compliment the Compact 50 Thin Section Preparation System. The bonding unit and hotplate are ideal for research or education purposes. -
The production of thin and ultra thin sections of materials requires the sample material to be fixed to a substrate （e.g. glass microscope slide） for support during processing. -
For easily achievable impregnation results, the CitoVac provides superior capabilities and trouble-free operation. Its spacious vacuum chamber and clear, user-friendly display offers great ease of use
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