產(chan)品分類展示(shi)
Logitech精(jing)密(mi)材料表(biao)面處(chu)理(li)
晶(jing)圓(yuan)拋(pao)光
晶(jing)圓(yuan)背(bei)減(jian)薄
碲鋅鉻材料磨(mo)拋(pao)機(ji)
三(san)五(wu)族材料磨(mo)拋(pao)機(ji)
精(jing)密(mi)研磨拋(pao)光系統(tong)
化(hua)學機(ji)械研磨拋(pao)光
智能研磨拋(pao)光機
化(hua)學拋(pao)光設備(bei)
精(jing)密(mi)切割設備(bei)
薄片制備系統(tong)
自動粘片(pian)機(ji)
粘片(pian)、測(ce)量檢(jian)測(ce)設備(bei)
備(bei)品備件(jian)和(he)耗材
相關(guan)文(wen)章(zhang)
穩(wen)定(ding)同位(wei)素質(zhi)譜儀的(de)作(zuo)用(yong)有(you)哪(na)些?
EMA新(xin)品(pin)介(jie)紹(shao)-預填充(chong)反(fan)應管-還原管
化(hua)學拋(pao)光設備(bei)能夠(gou)處(chu)理(li)怎樣(yang)的(de)表(biao)面
DEMO大(da)連實(shi)驗(yan)室正式成(cheng)立
穩(wen)定(ding)同位(wei)素質(zhi)譜儀如何進(jin)行(xing)工作(zuo)?
精(jing)密(mi)拋光機讓(rang)物體(ti)獲得(de)更加(jia)光滑細(xi)致(zhi)的(de)表(biao)面質(zhi)量
壹(yi)文(wen)與您(nin)分享(xiang)選(xuan)購(gou)精(jing)密(mi)研磨機(ji)時(shi)所需要(yao)考慮(lv)的(de)關(guan)鍵因(yin)素
晶(jing)體(ti)Si片切割表(biao)面損傷及其(qi)對(dui)電(dian)學性(xing)能的(de)影(ying)響(xiang)
| 產(chan)品圖(tu)片 | 產品名稱/型(xing)號(hao) | 產品(pin)描述 |
-
The AWS1 Abrasive Wire Saw allows fragile or diffi cult materials to be cut or wafered without fear of the samples being damaged. Designed for use in photonics, semiconductor, opto-electronics
-
The APD1 is a combined annular and precision saw ideal for slicing wafers, crystals or semiconductor components up to 55mm in diameter. It is also suitable for precision dicing of wafers up to 100mm
-
The GTS1 Thin Section Cut-off and Trim Saw is ideal for geological application areas - cutting hard or soft rocks, concretes or cements with equally high effi ciency.
