產(chan)品分類展示(shi)
Logitech精(jing)密(mi)材料表(biao)面處(chu)理(li)
晶(jing)圓(yuan)拋(pao)光
晶(jing)圓(yuan)背(bei)減(jian)薄
碲鋅鉻材料磨(mo)拋(pao)機(ji)
三(san)五(wu)族材料磨(mo)拋(pao)機(ji)
精(jing)密(mi)研磨拋(pao)光系統(tong)
化(hua)學機(ji)械研磨拋(pao)光
智能研磨拋(pao)光機
化(hua)學拋(pao)光設備(bei)
精(jing)密(mi)切割設備(bei)
薄片制備系統(tong)
自動粘片(pian)機(ji)
粘片(pian)、測(ce)量檢(jian)測(ce)設備(bei)
備(bei)品備件(jian)和(he)耗材
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The AWS1 Abrasive Wire Saw allows fragile or diffi cult materials to be cut or wafered without fear of the samples being damaged. Designed for use in photonics, semiconductor, opto-electronics -
The APD1 is a combined annular and precision saw ideal for slicing wafers, crystals or semiconductor components up to 55mm in diameter. It is also suitable for precision dicing of wafers up to 100mm -
The GTS1 Thin Section Cut-off and Trim Saw is ideal for geological application areas - cutting hard or soft rocks, concretes or cements with equally high effi ciency.
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