產品分(fen)類展(zhan)示(shi)
Logitech精密(mi)材(cai)料表(biao)面(mian)處(chu)理(li)
晶(jing)圓拋(pao)光
晶(jing)圓背(bei)減薄(bo)
碲(di)鋅鉻材(cai)料(liao)磨拋(pao)機
三五(wu)族材料(liao)磨拋(pao)機
精密(mi)研(yan)磨拋(pao)光系統(tong)
化學(xue)機械(xie)研(yan)磨拋(pao)光
智(zhi)能研(yan)磨拋(pao)光機
化(hua)學(xue)拋(pao)光設(she)備(bei)
精密(mi)切(qie)割設(she)備(bei)
薄(bo)片(pian)制(zhi)備系統(tong)
自動粘片(pian)機
粘片(pian)、測(ce)量檢(jian)測(ce)設(she)備(bei)
備(bei)品(pin)備(bei)件(jian)和(he)耗(hao)材(cai)
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| 產品圖片 | 產品名稱/型號 | 產品描(miao)述 |
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Logitech將(jiang)推出全(quan)新的LP70多工(gong)位(wei)精密(mi)研(yan)磨和(he)拋(pao)光系統(tong)。 該高(gao)度(du)自動化(hua)系(xi)統(tong)具(ju)有創(chuang)新的特性(xing)和(he)功(gong)能,是(shi)需要(yao)高(gao)規格(ge)表面(mian)光潔度(du)和(he)平(ping)整(zheng)度(du)應(ying)用(yong)的(de)多晶(jing)圓加工的(de)理(li)想解(jie)決方(fang)案(an)。
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PM6精密(mi)研(yan)磨拋(pao)光系統(tong)是(shi)生(sheng)產商(shang)英國logitech公司(si)發(fa)布的壹款適(shi)用(yong)於(yu)科學(xue)研(yan)究水(shui)平(ping)的(de)研(yan)磨和(he)拋(pao)光機型,該機型是(shi)PM5型的升(sheng)級版(ban)。能夠完成4英(ying)寸及以(yi)下尺寸樣(yang)品的小(xiao)批(pi)量處(chu)理(li),整個過(guo)程(cheng)全(quan)封(feng)閉控制(zhi),並內(nei)置自清(qing)洗(xi)功(gong)能,提升(sheng)對(dui)操作(zuo)人(ren)員(yuan)的安全(quan)保(bao)護(hu);全(quan)部(bu)采用(yong)電腦(nao)程(cheng)序(xu)控制(zhi),可(ke)實(shi)現數(shu)據傳(chuan)輸(shu)、工藝(yi)存(cun)儲(chu)及數(shu)據實(shi)時監控與反(fan)饋(kui)等(deng)功(gong)能。
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Akribis-Air智(zhi)能研(yan)磨拋(pao)光機,具(ju)有高(gao)度(du)自動化(hua)的(de)獨立系統(tong),提供(gong)了工(gong)藝創(chuang)新,在(zai)短(duan)時間(jian)內(nei)可(ke)實(shi)現Z高(gao)水(shui)平(ping)的(de)處(chu)理(li)。完整的(de)Akribis-air研(yan)磨拋(pao)光系統(tong)具(ju)有智(zhi)能自動化(hua)的(de)功(gong)能,如(ru)盤面(mian)平(ping)整(zheng)度(du)控制(zhi)、夾具(ju)自動設(she)置(zhi)、動態(tai)負(fu)荷控制(zhi)、增(zeng)加控制(zhi)參數(shu)、實(shi)時數(shu)據收(shou)集和(he)反(fan)饋(kui)、計量磨料供(gong)應、自動清(qing)洗(xi)功(gong)能等(deng)。
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CMP Orbis 櫃(gui)式(shi)化學(xue)機械(xie)研(yan)磨拋(pao)光設(she)備(bei),The Orbis CMP system is a precision engineered, floor standing CMP tool ideally suited for R&D environments where the main purpose or application is to conduct pilot production tests with optimum ....
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The Logitech DP high speed polishing systems have been designed for semi automated ?nal stage polishing of hard materials, such as sapphire, silicon carbide or gallium nitride, to epitaxy ready qualit
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The Logitech DL precision lapping systems process materials with high geometric precision. These systems can process up to 4, 200mm/8” Ø samples (or multiple smaller samples) simultaneously.
