Logitech PM5精密研磨(mo)拋光系(xi)統是(shi)帶(dai)有壹(yi)個(ge)工作(zuo)站的(de)臺式(shi)機(ji)，適用於科(ke)學(xue)研究(jiu)水平的(de)研磨(mo)和拋(pao)光，能(neng)夠完成4英(ying)寸及(ji)以下(xia)尺寸樣(yang)品的(de)小批量處(chu)理(li)。具(ju)有加工(gong)樣(yang)品*性(xing)高(gao)、規(gui)格水平高(gao)、表面光潔(jie)等特(te)點(dian)。

The Logitech WSB unit offer premium bonding for the processing of fragile semiconductor wafers such as Silicon and Gallium Arsenide.

The AWS1 Abrasive Wire Saw allows fragile or diffi cult materials to be cut or wafered without fear of the samples being damaged. Designed for use in photonics, semiconductor, opto-electronics

Chemicals typically used in prime face polishing of semiconductor wafers or electronic and optoelectronic crystals, such as Bromine Methanol or acid etches, are highly aggressive and require ......

CMP Tribo 臺式(shi)化學(xue)機(ji)械(xie)研磨(mo)拋光設(she)備(bei),The Tribo CMP system is a precision engineered, bench top solution designed with one thing in mind - the research of wafer processes, including their associated wafer, pad and slurry interactions.

Logitech CP3000化學(xue)拋光設(she)備(bei)能(neng)很好(hao)的(de)滿(man)足(zu)腐蝕拋光溶(rong)劑，同樣(yang)也適(shi)用於腐(fu)蝕性(xing)較(jiao)弱(ruo)的(de)Chemlox拋(pao)光，如(ru)半(ban)導體晶(jing)片(pian)的(de)背(bei)拋光。現(xian)在(zai)的(de)電(dian)子(zi)器(qi)件對於晶(jing)片(pian)尺寸，表(biao)面(mian)平整度(du)、平行度(du)及(ji)厚度(du)控制(zhi)都(dou)有(you)非(fei)常苛刻的(de)控(kong)制(zhi)要(yao)求(qiu)，而CP3000化學(xue)拋光機(ji)，特(te)別(bie)是(shi)跟(gen)Logitech的(de)晶(jing)片(pian)處(chu)理(li)系(xi)統配合(he)使(shi)用作(zuo)為Z後(hou)壹(yi)個(ge)步驟時，能(neng)*達(da)到(dao)這(zhe)些控制(zhi)標(biao)準。